Samsung Electronics has started shipments of its next-generation HBM4 (High Bandwidth Memory) chips designed for AI accelerators and data center workloads.

The company forecasts that HBM-related sales could triple in 2026, driven by explosive demand for:

• AI model training infrastructure
• hyperscaler data center expansion
• next-gen GPUs and custom AI accelerators
• sovereign AI projects across Asia, the US, and the Middle East

HBM4 represents a major leap in:

• memory bandwidth
• energy efficiency
• integration with advanced AI GPUs

As AI workloads become larger and more memory-intensive, HBM has become a critical bottleneck component — giving suppliers significant pricing power during strong demand cycles.

For Samsung (005930.KR), aggressive HBM expansion could:

• improve margins within its semiconductor division
• strengthen competition with SK Hynix and Micron
• reinforce Korea’s position in the global AI supply chain

Investors will closely monitor:

• production yield rates
• capacity expansion timelines
• long-term contracts with Nvidia and other AI chipmakers

The AI hardware cycle remains one of the strongest structural themes in global equities — and HBM is at its core.